R&D department verifies that 3 new TONSAN epoxy adhesives are recently developed for electronic industry. They are TONSAN 1309 chip bonder, TONSAN 1380 electric conductive adhesive and TONSAN 1361 bonding adhesive.

TONSAN 1309 chip bonder is a single component epoxy that cures by heating. It has fast curing speed, high tack strength, good stability, excellent electrical performances, good weather resistance, chemical resistance and burning resistance. Suitable for middle to high speed adhesive machine to apply on PCBs with shallow colors

TONSAN 1380 electric conductive adhesive is a single component epoxy filled with silver . It cures by heating and has fast curing speed, excellent electric and heat conductivities, good weather resistance and good stability.Good for screen printing and syringe application.

TONSAN 1361 bonding adhesive is a single component epoxy for electronic package. It cures by heating and has fast curing speed, dim color, good stability and high peel off strength after curing.It also has excellent electrical performances, weather resistance, burning resistance and chemical resistance. Suitable for packing semi-conductor chips.